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Epoxy resins are generally referred to as organic compounds containing two or more epoxy groups in the molecule, and their individual molecular weights are not high except for a few. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain. The epoxy group can be located at the end, in the middle or in a ring structure of the molecular chain. Due to the presence of reactive epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble polymers having a three-dimensional network structure. Polymer compounds containing epoxy groups in their molecular structure are collectively referred to as epoxy resins. The cured epoxy resin has good physical and chemical properties. It has excellent adhesion strength to the surface of metal and non-metal materials, good dielectric properties, small deformation and shrinkage rate, good dimensional stability, high hardness, and flexibility. It is good in nature, stable to most alkalis and solvents, and is widely used in national defense and national economy departments for pouring, dipping, laminating, adhesives, and coatings.
Since 1958, our country began to study epoxy resin, and has invested in industrial production at a rapid rate. It has been flourishing throughout the country, except for the production of common bisphenol A-epichlorohydrin epoxy resins. Various types of new epoxy resins are also produced to meet the urgent needs of national defense construction and national economic departments.
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